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Product Description
The Hybrid Device combines optical and electrical functionalities in a single compact module, enabling seamless integration of photonic and electronic components. It integrates a high-speed optical transceiver with low-power electronic circuits, supporting both analog and digital signal processing. The device features a hermetically sealed package with built-in temperature control and EMI shielding, ensuring stable performance in noisy environments. With a footprint of ≤20mm x 15mm, it is optimized for applications requiring high-density integration, such as 5G fronthaul networks and data center interconnects.
Multi-Functional Integration: Combines laser diodes, photodetectors, and signal conditioning circuits.
High-Speed Operation: Supports data rates up to 100 Gbps with low latency (<1 ns).
Low Power Consumption: Advanced CMOS technology reduces power dissipation to ≤2 W.
Thermal Stability: Built-in thermoelectric cooler (TEC) maintains optimal operating temperature.
EMI Immunity: Shielded design minimizes electromagnetic interference for reliable operation.
5G Networks: Enables backhaul connections in wireless base stations.
Data Centers: Facilitates high-speed optical links between servers and switches.
Industrial Automation: Supports real-time monitoring in smart manufacturing systems.
Medical Imaging: Enhances resolution in MRI and CT scanners through optical-electrical integration.
Aerospace: Reliable performance in avionics systems and satellite payloads.
Q: What protocols does it support?
A: Compatible with Ethernet, Fibre Channel, and CPRI standards.
Q: Can it operate in harsh environments?
A: Yes, it meets MIL-STD-810H for shock and vibration resistance.
Q: What is the typical latency?
A: ≤1 ns for optical-to-electrical conversion.
Q: How is thermal management achieved?
A: A TEC and heat sink efficiently dissipate heat.
Q: Is it RoHS compliant?
A: Yes, the device meets RoHS and REACH environmental standards.
| Parameter | Spec | Unit | ||||||||
| Center Wavelength | 2000 | 1150 | 1130 | 1064 | 980 | 850 | 780 | nm | ||
| Operating Wavelength Range | ±50 | ±50 | ±50 | ±30 | ±10 | ±10 | ±10 | nm | ||
| Typical Insert loss@23℃ | 0.8 | 0.3 | 0.3 | 0.5 | 0.6 | 0.6 | 0.6 | dB | ||
| Max.Insertion Loss @23℃ | 1.0 | 0.5 | 0.5 | 0.7 | 0.8 | 0.8 | 0.8 | dB | ||
| Min.Return Loss | 50 | 50 | 50 | 50 | 50 | 50 | 50 | dB | ||
| Typical Extinction Ratio @23℃ | 22 | 30 | 30 | 30 | 30 | 28 | 28 | dB | ||
| Min.Extinction Ratio @23℃ | 20 | 28 | 28 | 28 | 28 | 25 | 25 | dB | ||
| Input&Output Fiber Type | SM→SM or SM→PM | / | ||||||||
| Max.Optical Power(CW) | 300 | mW | ||||||||
| Max.Tensile Load | 5 | N | ||||||||
| Operating temperature | -5~+70 | ℃ | ||||||||
| Storage temperature | -40~+85 | ℃ | ||||||||

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