Mini hybrid devices

Features:

Low Insertion Loss
High Return Loss High Extinction Ratio
High Stability and Reliability

Applications:

Communication Systems
Test Instrument
Fiber Sensors
Product Development

Quantity:
Availability:





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Product Description

Parameter	Spec							Unit
Center Wavelength	2000	1150	1130	1064	980	850	780	nm
Operating Wavelength Range	±50	±50	±50	±30	±10	±10	±10	nm
Typical Insert loss@23℃	0.8	0.3	0.3	0.5	0.6	0.6	0.6	dB
Max.Insertion Loss @23℃	1.0	0.5	0.5	0.7	0.8	0.8	0.8	dB
Min.Return Loss	50	50	50	50	50	50	50	dB
Typical Extinction Ratio @23℃	22	30	30	30	30	28	28	dB
Min.Extinction Ratio @23℃	20	28	28	28	28	25	25	dB
Input&Output Fiber Type	SM→SM or SM→PM							/
Max.Optical Power(CW)	300							mW
Max.Tensile Load	5							N
Operating temperature	-5~+70							℃
Storage temperature	-40~+85							℃

Product Description

The Mini Hybrid Devices are compact, high-performance modules integrating optical and electrical functionalities to enable seamless photonic-electronic convergence in space-constrained applications. Each device combines a high-speed optical transceiver (laser diode/photodetector) with low-power signal processing circuitry (amplifiers, drivers, or controllers), all housed in a hermetically sealed package (≤15mm x 10mm x 5mm). Engineered for high-density integration, they support both analog and digital signal processing, making them ideal for next-generation communication, sensing, and automation systems.

Features

Multi-Domain Integration: Combines optical input/output (via FC/APC or LC connectors) with electrical interfaces (GPIO, I2C, SPI) for real-time control and monitoring.

High-Speed Signal Processing: Supports data rates up to 50 Gbps (digital) or 10 GHz (analog) with ultra-low latency (<1 ns for optical-to-electrical conversion).

Low Power Consumption: Advanced CMOS technology ensures power dissipation ≤1.5 W (active), ≤100 μW (standby), ideal for battery-powered or thermal-constrained systems.

Thermal & EMI Stability: Built-in thermoelectric cooler (TEC) maintains die temperature within ±0.5°C, while a metallic shield reduces electromagnetic interference (EMI) by ≥20 dB.

Flexible Configuration: Customizable for specific protocols (Ethernet, CPRI, Fibre Channel) and wavelengths (850 nm, 1310 nm, 1550 nm).

Applications

5G & 6G Networks: Enables compact 前传 /backhaul links in massive MIMO base stations, reducing size and power consumption in remote radio heads (RRHs).

Data Centers: Facilitates high-density optical interconnects in 400G/800G switch fabrics, minimizing latency and cabling complexity in server racks.

Industrial Automation: Integrates optical feedback with electrical control in smart factories, supporting real-time monitoring of robotic arms and conveyor systems.

Medical Devices: Combines optical imaging (e.g., OCT, endoscopy) with low-power signal processing in minimally invasive surgical tools.

Aerospace & Avionics: Reliable performance in airborne systems (e.g., missile guidance, drone communication) with strict SWaP (size, weight, power) constraints.

Faq

Q: What is the key advantage of a hybrid device over separate optical and electrical components?A: Integration reduces signal loss, latency, and electromagnetic interference while saving 50%+ space compared to discrete solutions.

Q: Can it operate at cryogenic temperatures for quantum computing?A: Standard models operate from -20°C to 70°C; cryogenic variants (-196°C to 25°C) are available for specialized research applications.

Q: How are optical and electrical signals isolated to prevent crosstalk?A: A dual-layer PCB with ground planes and shielded vias ensures signal isolation ≥30 dB across all frequency bands.

Q: What is the typical bit error rate (BER) for digital models?A: BER ≤1e-12 at 50 Gbps with appropriate signal conditioning, meeting industry standards for data center applications.

Q: Is programming support available for custom signal processing?A: Yes, firmware development kits (FDKs) include drivers for popular OSes (Linux, Windows) and hardware description languages (Verilog).